Grinding & Classification Circuits

Grinding & Classification Circuits 2017-04-04T06:57:16+00:00
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Relationship between Bond Abrasion and Bond Work index (1 reply)

Question Emailed
1 year ago
Question Emailed 1 year ago

Typically we work with Bond Ai for specifying our equipment into the mining industry. The relationship between Bond Ai and Bond Work index as I understand is the higher the number on the Bind Work Index the more abrasive the material is. Can you please confirm this?

David
1 year ago
David 1 year ago

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