Grinding & Classification Circuits

Grinding & Classification Circuits 2017-03-23T09:46:37+00:00
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Relationship between Bond Abrasion and Bond Work index (1 reply)

Question Emailed
12 months ago
Question Emailed 12 months ago

Typically we work with Bond Ai for specifying our equipment into the mining industry. The relationship between Bond Ai and Bond Work index as I understand is the higher the number on the Bind Work Index the more abrasive the material is. Can you please confirm this?

David
12 months ago
David 12 months ago

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